TAPIR
Modular power module with integrated cooling
Benefits
- This new power module technology adapted to fast components incorporates an air cooler whose mass is greatly reduced in comparison with the current state of the art
Key words
- Power electronics
- Cooling
- Semiconductor components
- 3D packaging
Intellectual Property
- 1 patent
Partnerships & Rewards
- Région Auvergne-Rhône-Alpes
Laboratory
- G2Elab
Institutions
- CNRS
- GRENOBLE INP-UGA
- UGA
Linksium Continuum
- Maturation
- Incubation
- Commercialization
Results
- Available licenses
Context
The power semiconductor components are incorporated in multichip cases called power modules. These modules enable the efficient removal of heat, and their parasitic electrical elements (inductance, capacitance) must be optimised to allow the implementation of the increasingly fast components.
Technology
The originality of the TAPIR project lies in the interconnection of the semiconductor components through the intermediary of the heat dissipaters. The electrical connections and the distribution of the heat dissipation are then optimised. This last point enables a drastic reduction in the mass of the cooling system.
Advantages
This technology decreases the mass of energy conversion systems: reduction in the mass of a cooling system by a ratio of 3. It will enable the optimum use of large-gap semiconductor components, a guarantee of additional gains on the overall mass.
State of progress
A prototype was developed and tested at low voltage.
Applications
It will be possible to use this technology profitably in most air-cooled static converters, particularly in the aeronautics and server sectors.
