3D magnetic characterization
- Hprobe Machines allows to characterize under 3D magnetic field the new microelectronic components
- 1 patent
- 3 software
Partnerships & Rewards
- 2017 French Deeptech Innovation Competition Winner
- Incorporated startups
The microelectronic components of spintronique and magnetic type develops fast (MRAM, sensors, Mems). The laboratory Spintec developed characterization tools under magnetic field to make electric measures in a statistical way and the algorithms which allow to go back to the information on the physics of the technological choices.
The magnetic head Hprobe (patentee) allows to generate a customizable field in intensity in 3 dimensions of the space at the level of components to be tested who are on the water. Algorithms developed by Spintec allow to go back to the physical characteristic of components.
Today, the researchers use either discreet components in 3D magnetic fields, or components on wafer under fixed or customizable fields in an only way. To pass at the industrial stage, the essays of characterization require the use of a 3D field on wafer.
State of progress
After a first machine installed in the Imec laboratory in Belgium, Hprobe built and installed a first "industrial" machine in Taiwan at one of the largest wafer manufacturers in the world. The machine has been qualified and several other testers are being delivered to Europe and China. The team is growing and a fundraising campaign is underway to prepare for the strong growth expected in this market.
Associated with a "prober", a machine allowing to move the wafer in the plan, it is possible to realize a large number of electric measures on components.
The laboratory R*D which will equip themselves with the machine Hprobe will be able to finalize the industrial technologies of realization of components using magnetic materials: MRAM (STT, FOOL, …) - Mems - Sensors.
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